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Knowledge Centre

Glossary and Abbreviations - Abbreviations for Printed Circuit Boards

Click on an alphabet below to directly jump to the chosen alphabet section...

ABCDEFGHIJKLMNOPQRSTUVWXYZ

Alphabet A [ Go to TOP ]

  • ACalternate current
  • ACIautomatic component inser tion
  • ADJadjust
  • ALaluminum = Aluminium
  • AMPamperage / Ampere
  • AMTamount
  • ANALanalysis / analyze
  • ANGangle
  • ANSIAmerican National Standards Institute
  • AOIautomatic optical inspection
  • APLapplicable
  • APRautomatic photo tool registration
  • AQLacceptance quality level
  • ARannular ring
  • ASAPas soon as possible
  • ASSYassembly
  • ASTMAmerican Society for Testing & Materials
  • AUgold
  • AUTHauthorize / authorization
  • AUXauxiliary
  • AVGaverage
  • AWartwork

Alphabet B [ Go to TOP ]

  • B&Tbow and twist
  • BBTbare board test
  • BDboard
  • BGAball grid array
  • BKback
  • BKPLNbackplane
  • BKPNLback panel
  • BKTbracket
  • BLKblack / block
  • BLNKblank
  • BLUblue
  • BObreak out
  • BOMbill of material
  • BPbackplane / back panel
  • BRDboard
  • BSbackside
  • BTMbottom
  • BUMbuilt up method
  • BUTbuilt up technology
  • BVHburied via hole
  • BVLbevel

Alphabet C [ Go to TOP ]

  • Ccircuitry
  • CADcomputer-aided design
  • CAEcomputer-aided engineering
  • CAIcomputer-aided instruction
  • CALCcalculate
  • CAMcomputer-aided manufacturing
  • CAPcapacitor / capacity
  • CBOREcounter bore
  • CCconformal coating
  • CCCcurrent carrying capacity
  • CEM-1Composite epoxy material. Laminate manufactured with a paper core, outer layers of fibre-glass and epoxy as binding agent. Normally non-inflammable = Composite Epoxy Material.
  • CFcopper foil
  • CHARcharacter / characteristic
  • CHGchange
  • CHKcheck
  • CIcontrolled impedance
  • CIRCcircuit
  • CLclass
  • CLNclean
  • CLRclear / clearance
  • CMPcomponent
  • CNCcomputer numerically controlled
  • CNTcount
  • CNTRcenter
  • CNTRLcontrol
  • COBchip on board
  • CofCcertificate of conformance
  • COMPcomponent
  • CONDconductor / condition
  • CONFconformance / conference
  • CONNconnector
  • CEM-3Composite epoxy material. Laminate manufactured with non-woven glass matting as core, outer layers of gass weave and epoxy as binding agent. Normally noninflammable = Composite Epoxy Material.
  • CONTcontinue / continuity
  • Cpkprocess capability index (range within specification)
  • CPNcoupon = Coupon
  • CScomponent side
  • CSKcountersink
  • CSPchip size package
  • CTEcoefficient of thermal expansion
  • CUcopper
  • CVRcover

Alphabet D [ Go to TOP ]

  • DCdirect current / date code / document control
  • DECdecimal
  • DECdocument
  • DEGdegree
  • DEPdeposit / deposition
  • DESdevelop-etch-strip / design
  • DESCDefense Electronic Supply Center = Defense Electronic Supply Center (USA)
  • DFdry film / difunctional
  • DFMdesign for manufacturability
  • DFTdouble-treat foil / design for test
  • DIAdiameter
  • DIELdielectric
  • DIMdimension = Dimension
  • DISTdistribute / distribution
  • Dkdielectric constant
  • DLADefense Logistics Agency = Defense Logistics Agency (USA)
  • DODDepar tment of Defense / Date of Delivery
  • DPdrill program
  • DRCdesign rule check
  • DRLdrill
  • DSdimensional stability / double-sided
  • DTFdouble-treat foil
  • DTLdetail = Detail
  • DTPdiameter
  • DWGdrawing
  • DWVdielectric with standing voltage

Alphabet E [ Go to TOP ]

  • E-AUelectroless gold
  • ECeach
  • EEelectrical engineer
  • EMSelectronics manufacturing services
  • EMULemulsion = Emulsion
  • ENGengineer / engage
  • ENGRengineer
  • E-NIelectroless nickel
  • ENIGelectroless nickel immersion gold
  • ERrelative dielectric constant
  • ESDelectro-static discharge / electro-static device
  • ETelectrical test
  • EVALevaluation / evaluate
  • EXexample
  • EXPexpose / exposure / expire
  • EXTexternal / extension

Alphabet F [ Go to TOP ]

  • FR2Flame Retardant. Laminate manufactured from paper with phenolic binding agent. Flame retardant material has been added
  • FR3Flame Retardant. Laminate manufactured from paper with epoxy binding agent. Flame retardant material has been added.
  • FAfirst article
  • FABfabrication / fabricate
  • FAEfirst article report
  • FAIfirst article inspection
  • FGIfinished goods inventory
  • FHSfinished hole size
  • FR4Flame Retardant. Laminate manufactured from fibre-glass weave with epoxy binding agent. Flame retardant material has been added.
  • FLTflat
  • FMfrom
  • FNLfinal
  • FPWflex printed wiring
  • FREQfrequency
  • FSfar side
  • FUNCfunction / functional

Alphabet G [ Go to TOP ]

  • GLSglass
  • GNDground
  • GRNgreen

Alphabet H [ Go to TOP ]

  • HALhot air leveling
  • HARBheight aspect ratio boards
  • HASLhot air solder levelling
  • HDIShigh density interconnection system
  • HLhole
  • HLSholes
  • HMTHole mounting technology. Leaded components are mounted by inser ting (and soldering) their leads through holes in the PCB
  • HRChigh resin content
  • HTEhigh tensile elongation

Alphabet I [ Go to TOP ]

  • IECInternational Electro-technical Commission
  • IJInkjet
  • IJPInkjet Printing
  • ILinner layer
  • ILinsulation resistance / infrared
  • IMGimage
  • IMMimmersion
  • IMMAUimmersion gold
  • INSPinspect / inspection
  • INTinternal
  • INVinventory
  • IPCInstitute for Interconnecting and Packaging Electronic Circuits
  • ISinside / information system
  • ISSissue
  • ITRIInterconnection Technology Research Institute
  • IVHInterstitial Via Hole (Board)

Alphabet J [ Go to TOP ]

  • JITJust in time
  • JSJump Scoring

Alphabet K [ Go to TOP ]

  • KFkapton film

Alphabet L [ Go to TOP ]

  • LAMlaminate / lamination
  • LCCleadless chip carrier
  • LCCCleadless ceramic chip carrier
  • LDILaser Direct Imaging
  • LDPLaser Direct Patterning
  • LDSLaser Direct Structuring
  • LEGlegend
  • LIGALithography and Galvanoforming (technique)
  • LOClocate / location
  • LPIliquid photoimageable
  • LPISRliquid photoimageable solder resist
  • LRClow resin content
  • LSRlaser
  • LWline width
  • LYRlayer

Alphabet M [ Go to TOP ]

  • MATLmaterial = Material
  • MBVmicro blind via
  • MEmechanical engineer
  • MFmultifunctional
  • MFGmanufacturing
  • MFRmanufacturer
  • MGRmanager = Manager
  • MINminimum = Minimum
  • MIPmanufacturing instruction procedure / multiple inline package
  • MIRmoisture & insulation resistance
  • MLmultilayer
  • MLBmultilayer board
  • MMCmaximum material condition
  • MRBmaterial review board
  • MRPmanufacturing resource planning
  • MSGmessage
  • MSTRmaster
  • MTLmetal
  • MVmicro via
  • MVHmicro via hole

Alphabet N [ Go to TOP ]

  • NAnot applicable
  • NCnumerically controlled
  • NCMnon-conforming
  • NEGnegative
  • NEMANational Electrical Manufacturer's Association
  • NFnon-functional
  • NHSnominal hole size
  • NInickel = Nickel
  • Ni/Pnickel / phosphor
  • NOMnominal
  • NPnon-plated
  • NPTnon-plated thru
  • NPTHnon-plated-thru hole
  • NSTDnon-standard
  • NTSnot-to-scale

Alphabet O [ Go to TOP ]

  • OAoverall
  • OAIo.k. as is
  • ODouter diameter
  • OEMoriginal equipment manufacturer
  • OLouter layer
  • ORGorganize / organization
  • ORIGoriginal
  • OSoptical sight / Fiducial marks
  • OSIon-screen inspection
  • OSPorganic solderability preservative (anti-oxidant coating)
  • OZounce

Alphabet P [ Go to TOP ]

  • PACpad array carrier
  • Pblead
  • PbSnlead-tin
  • PCprinted circuit / production control
  • PCBprinted circuit board
  • PCTpressure cooker testing
  • PEproduct engineer / process engineer
  • PEBpost exposure bake
  • PEPpost-etch punch
  • PFIpolymer film interconnect
  • PIDphotoimageable dielectric
  • PIHpin in hole
  • PLparts list
  • PLCplace
  • PLCSplaces
  • PLNplane / plan
  • PLNGplanning
  • PLNRplanner
  • PLTplate
  • PLTDplated
  • PMpreventive maintenance
  • PNLpanel
  • POSpositive
  • PPprepreg
  • PQFPplastic quad flat package
  • PROGprogram
  • PSFper square foot
  • PSIper square inch
  • PTperfect test / point
  • PTHplated-thru hole
  • PTSpoints
  • PWAprinted wiring assembly
  • PWBprinted wiring board

Alphabet Q [ Go to TOP ]

  • QAquality assurance
  • QCquality control
  • QEquality engineer
  • QFPquad flat pack
  • QPLquality product level
  • QTAquick-turn around
  • QUALqualification / qualify

Alphabet R [ Go to TOP ]

  • RADradius / radii
  • RCCresin coated copper foil
  • REFreference
  • REGregistration / register
  • REINreinforce
  • RELrelease
  • REMremove
  • REPrepresentative / represent
  • REPLreplace
  • REQrequest / require
  • RESresistor
  • RFQrequest for quotation
  • RMKremake
  • RProut program
  • RPRrepair
  • RPTreport
  • RTrout
  • RTFreverse-treat foil
  • RWKrework

Alphabet S [ Go to TOP ]

  • SBCsolder ball connect
  • SBUsequential built-up
  • SnTin
  • SNserial number
  • SCRNscreen
  • SPspace
  • SQsquare
  • SEPseparate
  • SECTsection
  • SHTsheet
  • SIASemiconductor Industry Association
  • SIGsignal
  • SIPsingle in-line package
  • SIRsur face insulation resistance (resistivity)
  • SLDsolder
  • SLTslot
  • SMCsurface-mount component
  • SMDsurface-mount device
  • SMPsurface-mount pad
  • SMTsurface-mount technology
  • SMOBCsolder mask over bare copper
  • SMOGBsolder mask over gold body
  • SPCstatistical process control
  • SPECspecification
  • STDstandard
  • SSsolder side
  • SSDSolid Solder Deposit
  • STKstock / stack
  • SYMsymbol
  • SRCSemiconductor Research Consor tium
  • S&Rscrap and rework
  • SLDsolder
  • SQFTsquare foot
  • SQINsquare inch

Alphabet T [ Go to TOP ]

  • TFtetra functional
  • Tgglass transition temperature
  • THtooling hole(s)
  • TPtrue position
  • TRtransfer
  • TABtape-automatic bonding
  • TDRtime domain reflectometer
  • TGPtrue grid position
  • TGTtarget

Alphabet U [ Go to TOP ]

  • ULUnderwriter's Laboratories Inc.
  • UAIuse as it
  • UOSunless otherwise specified

Alphabet V [ Go to TOP ]

  • Vvoltage = Volt

Alphabet W [ Go to TOP ]

  • Wwidth
  • W&Twarp and twist
  • WBwire bonding
  • WHTwhite
  • WEEEwaste electronic and electrical equipment

Alphabet X [ Go to TOP ]

  • XFPextra fine pitch

Alphabet Y [ Go to TOP ]

Alphabet Z [ Go to TOP ]

  • ZDSzero defect strategy
  • APRzero defect program

PCB Design Tips

When designing a PCB, try to limit the amount of draws you use. Draws use a lot of memory and slow the programming time. Use a flash for pads instead.

More tips...
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