- +61 1300 BUY PCB (1300 289 722)
- +61 3 9111 1887
Whether you need rigid or flexible, single, double or multi-layered PCBs we can help... At QualiEco Circuits we advise on the manufacture and assemble of all types printed circuits board (PCBs)
Capability
QualiEco Circuits Australia's technical capability in detail for your PCB manufacturing requirements in small volume – we’re always one step ahead in technology and innovation.
Rigid PCBs Small Volume – In detail
DescriptionStandard PCBs Prototype PCBs
PCB Details
- Max. no. of layers28 layers32 layers
- Max. board size (L x W) in mm900mm x 580mm1200mm x 600mm
- Max. board thickness (in mm.)3.2mm6mm
- Min. finished board thickness (in mm.)0.4mm0.2mm
- Min. Core Thickness0.13mm0.13mm
- Min. Dielectric0.075mm0.075mm
Base Material
- (A) Base MaterialFR4 (Std, High Tg & HF)FR4 (Std, High Tg & HF)
- (B) Inner layer Copper cladding
- * Max. Cu Wt. For Planes (Oz.)105µm (3oz)210µm (6oz)
- * Max. Cu Wt. For Signals (Oz.)105µm (3oz)210µm (6oz)
- * Min. Cu Wt. (Oz.)18µm (1/2oz)12µm (1/3oz)
- (C) Outer layer Copper cladding
- *Max Cu Wt. (Oz.)140µm (4oz)210µm (6oz)
- *Min Cu Wt. (Oz.)35µm (1oz)35µm (1oz)
Etching
- Minimum (in mils)
- For copper thickness of 0.5 OzTrace Width: 4mil
Spacing: 4milTrace Width: 3mil
Spacing: 3.5mil - For copper thickness of 1.0 OzTrace Width: 4mil
Spacing: 4milTrace Width: 3mil
Spacing: 3.5mil - For copper thickness of 2.0 OzTrace Width: 8mil
Spacing: 8milTrace Width: 7mil
Spacing: 7mil - For copper thickness of 3.0 OzTrace Width: 9mil
Spacing: 10milTrace Width: 9mil
Spacing: 10mil
Drilling
- Min. finished via hole size
- Mechanical Drilling0.2mm0.2mm
- Laser Drilling0.15mm0.1mm
- Min. finished via pad size0.5mm0.4mm
- Min. annular ring (via holes)5 mils4 mils
- Min. annular ring (Component holes)8mil6 mils
- Min. hole size tolerance (in mils)
- Hole size < 0.024"PTH: +/-0.076mm
NPTH: +/-0.05mmPTH: +/-0.076mm
NPTH: +/-0.05mm - Hole size > 0.024" < 0.138"PTH: +/-0.076mm
NPTH: +/-0.05mmPTH: +/-0.076mm
NPTH: +/-0.05mm - Hole size > 0.138"PTH: +/-0.076mm
NPTH: +/-0.76mmPTH: +/-0.076mm
NPTH: +/-0.76mm - Blind & Buried vias manufacturableYESYES
- Drill to track clearance for inner layers0.18mm (4L)
0.20mm (6L)
0.25mm (8L)
0.30mm (10L)0.18mm (4L)
0.20mm (6L)
0.25mm (8L)
0.30mm (10L) - Min. annular ring (Component holes)0.2mm to 0.4mm0.2mm to 0.4mm
Plating / Surface Treatment
- HASLYESYES
- Electrolytic GoldYESYES
- Electroless Nickel / GoldYESYES
- SMOBC with OSP (Entek Coating)YESYES
- Immersion SilverYESYES
- Immersion TinYESYES
Layer construction & Impedance Design
- Min. core thickness0.09mm0.06mm
- Preferred varieties of Thin core laminates generally stocked (in mils) 0.09/ 0.13/ 0.15/ 0.2/ 0.27/ 0.3/ 0.35/ 0.4/ 0.5/ 0.6/ 0.8/ 1.0/ 1.2mm0.06/ 0.13/ 0.15/ 0.2/ 0.27/ 0.3/ 0.35/ 0.4/ 0.5/ 0.6/ 0.8/ 1.0/ 1.2mm
- Prepregs generally stocked (in mils)2.56mil3.54mil
Maximum Fabrication Tolerance
- Maximum Fabrication Tolerance5mil5mil
Solder mask
- Mask opening (pad + XXX)4mil3mil
- Min. solder mask web width between pads5mil4mil
- PAD to PAD min. space if web required3mil3mil
- SM clearance to PAD3mil2.5mil
- Min. SM thickness0.4mil0.4mil
Component Reference (Silk Screen)
- Legend (Silk Screen) line width6mil5mil
- Min. character height30mil25mil
- Min. character spacing4mil4mil
Electrical Test
- CAD net list testing (IPC356D)7mil4mil
- Min. SMD pitch testable0.4mm0.3mm
- Min SMD pad width testable0.2mm0.2mm
- Max testing area (mm x mm)400mmx600mm600mmx1200mm
- Testing voltage250V DC250V DC
- Open resistance10MΩ10MΩ
- Short resistance50MΩ50MΩ
- Top and Bottom Test simultaneouslyYESYES
Controlled Impedance measurement
- Controlled Impedance measurementYESYES
Inner Layers (VCC and GND Layers)
- Minimum Isolation from finished Drill0.18mm (4L)
0.20mm (6L)
0.25mm (8L)
0.30mm (10L)0.18mm (4L)
0.20mm (6L)
0.25mm (8L)
0.30mm (10L) - Up to 8 Layers (Single Stage bonding)10mil8mil
- Up to 8 Layers (Two times bonding)10mil8mil
- Up to 8 layers (more than two times)10mil8mil
- Above 8 layers(Single Stage bonding)12mil10mil
- Min. Annular ring for thermal pads10mil6mil
- Min. Thermal Air Gap8mil5mil
- Cu area to PCB edge clearance0.25mm0.2mm
Inner Layers (Signal Layers)
- Minimum Annular Ring5mil4mil
- Finished Drill to Track clearance0.18mm (4L)
0.20mm (6L)
0.25mm (8L)
0.30mm (10L)0.18mm (4L)
0.20mm (6L)
0.25mm (8L)
0.30mm (10L) - Up to 8 Layers (Single Stage bonding)10mil8mil
- Up to 8 Layers (Two times bonding)10mil8mil
- Up to 8 layers (more than two times)10mil8mil
- Above 8 layers(Single Stage bonding)12mil10mil
- Cu area to PCB edge clearance12mil8mil
Scoring (V-cut)
- Score line to Cu area clearance0.4mm0.4mm
Routing
- Minimum router diameter0.8mm0.8mm
- Cu area to PCB edge clearance (Outer Layer)0.25mm0.15mm
- Cu area to PCB edge clearance (Inner Layer)0.3mm0.2mm
Slot
- Minimum slot size0.8mm0.8mm
1. We prefer min. pad size >= hole size + 0.50 mm for any PTH hole.
2. NPTH holes should preferably not have any pad around them.
3. Jump scoring and depth routing possible – conditions apply
Product Comparison Chart
We have the capability to manufacture and assemble Single Sided/Layer (SS), Double Sided/Layer (DS-NPTH & DS-PTH) and MultiLayer (up to 32 layers) PCBs with RoHS as an option.
Compare Low Cost Prototype with Standard Prototype and Production. Choose one which best suits your requirements.
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Our capabilities
We can manufacture and assemble Single Sided/Layer (SS), Double Sided/Layer (DS-NPTH & DS-PTH) and MultiLayer (up to 32 layers) PCBs with RoHS as an option.
Need to know more about our capabilities?
What our customers say?
QualiEco Circuits Limited is an excellent supplier to us! We appreciate the quality of service and support that we receive from QualiEco Circuits. They always deliver what is promised
For printed circuit boards (PCBs) or PCB assembly you can count on. Talk to the friendly and experienced team at QualiEco Circuits, Australia.